EziLab offers the Temperature Test Chamber EZL-TC156, a 12 L benchtop thermal chamber that cycles single parts or a few specimens from -40 °C to +150 °C inside a 310 by 230 by 200 mm SUS304 workspace with an anticorrosive coating. Fluctuation stays within ±0.5 °C and uniformity within ±2.0 °C, air-cooled compressors drop the space from +25 °C to -40 °C in 45 minutes or less, NiCr heaters raise it from +25 °C to +130 °C in 30 minutes, and even airflow keeps corners in step. A 7 inch programmable touchscreen holds multi-step profiles, fiberglass and polyurethane insulation keep the shell cool, and the cabinet measures 500 by 540 by 650 mm at 89 kg. Choose it over the 16 L sibling when the test article is a single board or sensor and bench space is scarce. Electronics test centers screen boards and sensors on it, semiconductor labs stress chip packages, plastics makers watch material behavior across the range, and materials science departments run small-sample studies. Typical programs include solder joint cycling, cold start checks, and polymer embrittlement. Parts pulled out at -40 °C sweat in room air; add a return-to-ambient step to the program before opening the door. The 12 L size can be set against larger siblings through Climate Test Chamber and Temperature Test Chamber.



Quantity:
$8085
Internal volume 12 L
Temperature Range - 40˚C to +150 ℃
Temperature fluctuation ≤ ± 0.5℃
Temperature uniformity ≤ ± 2.0℃
Temperature deviation ≤ 1.5℃
Heating rate +25℃ to +130℃ ≤ 30 minutes
Cooling rate +25℃ to -40℃ ≤ 45 minutes
Inner chamber material SUS304 stainless steel plate
Exterior Material Reinforced Steel plate with electrostatic spraying
Insulation Superfine fiberglass wool/polyurethane foam
Refrigeration mode Refrigeration Compressors, air cooling
Controller 7” Programmable touchscreen controller
Heating System NiCr heater, independent system
Internal dimensions (D×W×H) 310 × 230 × 200 mm
External dimensions (D×W×H) 500 × 540 × 650 mm
Net Weight 89 Kg
Gross Weight 110 Kg
Feature AreaDescription
Air CirculationAir circulation through the workspace for conditioning samples.
InteriorStainless steel workspace with an anticorrosive interior coating.
Profile ControlTouchscreen controller for multi-step temperature profiles and thermal cycling.
Compact FormatBenchtop format sized for individual parts and small specimens.
Cooling & HeatingAir-cooled refrigeration paired with a heating system for cold and hot exposure.
  • Supports board and sensor testing in electronics test centers.
  • Handles chip package stress testing in semiconductor labs.
  • Suited to polymer embrittlement checks in plastics work.
  • Applied to small-sample studies in materials science.
  • Employed for solder joint and cold-start checks on individual parts.
  • Fits benchtop testing where bench space is limited.